Conduct-O-Fil® – electrically conductive particles
Conduct-O-Fil® is not a blasting abrasive. It is a family of functional conductive fillers added to formulations when the material must conduct electricity or provide electromagnetic shielding.
Each particle consists of a carefully selected core coated with a uniform metal layer. Depending on the Required result, different combinations of shape, size, density and metal coating are available, including silver, nickel and gold on cores made of glass, aluminium, copper, nickel, ferrite and other materials.
| application | Role of Conduct-O-Fil® fillers |
|---|---|
| EMI/RFI shielding for electronics | Creates a conductive path that limits electromagnetic interference |
| Conductive adhesives | Enables electrical contact while bonding components |
| Coatings and paints | Provides the surface with controlled electrical conductivity and a protective function |
| Sealants and elastomers | Provides a conductive connection between housings and assemblies |
| Lubricants and greases | Adds electrical conductivity to special formulations |
| Industrial and defence electronics | Used in demanding systems with defined EMI criteria |
Why it is used
| Benefit | Practical effect |
|---|---|
| high conductivity | Reliable electrical and EMI performance of the formulation |
| lower mass and cost | Potential partial replacement of expensive pure silver or heavy nickel powder |
| Core and coating selection | Adjustment of density, shape, size and conductivity |
| stability and oxidation resistance | Longer-lasting and more repeatable material behaviour |
| Controlled particle distribution | Easier design of the target viscosity and electrical properties |
The appropriate grade is not selected by name alone. The binder, mixing method, target conductivity or EMI performance, operating temperature, density and permitted filler loading must be known.
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